集电极-基极反向击穿电压V(BR)CBO Collector-Base Voltage(VCBO) Q1/Q2 |
50V/50V |
集电极-发射极反向击穿电压V(BR)CEO Collector-Emitter Voltage(VCEO) Q1/Q2 |
50V/50V |
集电极连续输出电流IC Collector Current(IC) Q1/Q2 |
100mA/100MA |
Q1基极输入电阻R1 Input Resistance(R1) |
4.7KΩ/Ohm |
Q1基极-发射极输入电阻R2 Base-Emitter Resistance(R2) |
47KΩ/Ohm |
Q1电阻比(R1/R2) Q1 Resistance Ratio |
0.1 |
Q2基极输入电阻R1 Input Resistance(R1) |
4.7KΩ/Ohm |
Q2基极-发射极输入电阻R2 Base-Emitter Resistance(R2) |
47KΩ/Ohm |
Q2电阻比(R1/R2) Q2 Resistance Ratio |
0.1 |
直流电流增益hFE DC Current Gain(hFE) |
|
截止频率fT Transtion Frequency(fT) Q1/Q2 |
250MHz/250MHZ |
耗散功率Pc Power Dissipation Q1/Q2 |
150mW/0.15W |
Description & Applications |
Features •General purpose (dual digital transistors) •Two DTC143Z chips in a EMT package. •Mounting possible with EMT automatic mounting machines. •Transistor elements are independent, eliminating interference. •Mounting cost and area can be cut in half. |
描述与应用 |
特点 •通用(双数字晶体管) •的两个DTC143Z芯片在EMT包。 •安装可能与EMT自动安装机器。 •晶体管元素是独立的,消除干扰。 •安装成本和面积可减少一半 |