| 集电极-基极反向击穿电压V(BR)CBOCollector-Base Voltage(VCBO) | 60V |
| 集电极-发射极反向击穿电压V(BR)CEOCollector-Emitter Voltage(VCEO) | 50V |
| 集电极连续输出电流ICCollector Current(IC) | 100mA/0.1A |
| 截止频率fTTranstion Frequency(fT) | 150Mhz |
| 直流电流增益hFEDC Current Gain(hFE) | 180~390 |
| 管压降VCE（sat）Collector-Emitter Saturation Voltage | 300mV/0.3V |
| 耗散功率PcPower Dissipation | 125mW/0.125W |
| Description & Applications | Two elements incorporated into one package (Each transistor is separated) Two elements incorporated into one package (Each transistor is separated) SSS Mini type SSS Mini type 66-pin package, reduction of the mounting area and assembly -pin package, reduction of the mounting area and assembly cost by one half Maximum package height ( Maximum package height (00..44 mm) contributes to develop thinner equipments |
| 描述与应用 | 两个要素纳入一包（每个晶体管分隔）两个要素纳入一个包（每个晶体管分离） SSS迷你型SSS迷你型66引脚封装，减少安装面积和汇编引脚封装，减少安装面积和汇编 一半的费用 最大封装高度（最大封装高度（00.. 44毫米），有助于开发出更薄的设备 |