贴片电阻 MMB0207501R50F 1808圆柱
| 电阻值Resistance | |
| 误差Tolerance | |
| 温度系数Temperature Coefficient | |
| 功耗Power Dissipation | |
| Description & Applications | Approved according to EN 140401-803 • Advanced thin film technology • Excellent overall stability: exceeds Class 0.25 • Force fitted steel caps, tin plated on nickel barrier • Pure Sn termination on Ni barrier layer • Compatible with lead (Pb)-free and lead containing soldering processes • Lead (Pb)-free and RoHS compliant |
| 描述与应用 | 批准根据EN140401-803 •先进的薄膜技术 •优秀的整体稳定性：高于0.25类 •强力配合钢帽，锡镀镍屏障 •镍阻挡层纯锡端接 •兼容铅（以Pb计）和含铅 焊接工艺 •铅（Pb），并且符合RoHS |
| 规格书PDF |
